RO4003c 0.5mm 2-Layer PCB Board for RF Electronics

Technical Specifications

Model NO.BIC-1273-V3.0

MaterialRogers RO4003c Laminate

ApplicationGPS Antennas

Flame RetardantV0

Mechanical RigidRigid

ProcessingImmersion Silver

Base MaterialRogers RO4003c Substrate

Board TypesRigid PCB

Test100% Electrical Test Prior Shipment

HS Code8534009000

Dimensions90.63mm × 170.35mm( ± 0.15m)

Production Capacity360000 Square Meters/Year

Product Overview

(Custom PCBs are tailored products; the images and specifications provided are for reference only.)

The RO4003C 0.5mm 2-layer PCB is a high-performance, ultra-thin circuit board designed for RF applications requiring both excellent electrical performance and compact form factors. Utilizing Rogers' innovative woven glass reinforced hydrocarbon/ceramic composite, this 0.5mm thick PCB delivers exceptional signal integrity (Dk 3.38±0.05) while maintaining FR-4-like manufacturability. The slim 0.5mm profile combined with its unique material composition bridges the gap between standard FR-4 and premium RF materials, offering the low-loss characteristics of PTFE with the cost-effectiveness of epoxy/glass processing.

PCB Construction Details

Parameter	Specification
Material	RO4003C (Hydrocarbon/Ceramic)
Layers	2
Dimensions	90.63×170.35mm (±0.15mm)
Thickness	0.5mm
Trace/Space	5/7 mils
Hole Size	0.3mm
Copper Weight	1oz (35μm) outer
Surface Finish	Immersion Silver
Solder Mask	Green (Top only)
Electrical Test	100% tested

Stackup Design

Copper_layer_1: 35 μm
Rogers 4003C Core: 0.406 mm (16mil)
Copper_layer_2: 35 μm

PCB Statistics: Components: 21 | Total Pads: 80 | Vias: 36 | Nets: 3

Key Material Advantages

💎

Ultra-thin Profile: 0.5mm thickness for space-constrained compact designs.

📈

Tight Dk Control: Dk 3.38±0.05 at 10GHz for precise signal integrity.

📉

Low Loss: Dissipation factor of 0.0027 at 10GHz.

🔥

Thermal Stability: CTE matched to copper (11/14 ppm/°C).

Typical Applications

Compact 5G base station antennas
Slim automotive radar modules
Miniature RFID tag antennas
Space-constrained satellite components

Why Choose This PCB?

🚀

Space Saving: Enables ultra-compact hardware designs.

💰

Cost Effective: 40% more economical than PTFE alternatives.

Frequently Asked Questions

Q1: What are the main benefits of using RO4003C over standard FR-4?

RO4003C offers significantly lower dielectric loss and much tighter control over the Dielectric Constant (Dk), making it superior for high-frequency RF applications where signal integrity is paramount.

Q2: Why is the 0.5mm thickness beneficial for modern electronics?

The 0.5mm ultra-thin profile allows engineers to design more compact and lightweight modules, which is essential for 5G mobile hardware, slim automotive sensors, and portable satellite equipment.

Q3: What is the advantage of the Immersion Silver surface finish?

Immersion Silver provides a flat surface for SMT components, offers excellent conductivity for high-speed signals, and is more cost-effective than ENIG while maintaining high reliability.

Q4: Can this PCB handle high-power RF conditions?

Yes, Rogers RO4003C is specifically engineered to withstand high-power RF conditions due to its high thermal conductivity (0.71 W/m/°K) and high glass transition temperature (Tg >280°C).

Q5: What file format is required for production?

Standard production requires Gerber RS-274-X files, though PCB.Doc and other common CAD exports are often supported for custom RF designs.

Q6: Is 100% electrical testing standard for these boards?

Yes, all high-frequency PCBs undergo 100% electrical testing prior to shipment to ensure zero-defect performance in critical RF environments.