Basic Information
Material
Ceramic, Hydrocarbon, and Thermoset Polymer
Processing Technology
Electrolytic Foil
Insulation Materials
Epoxy Resin
Surface Finish
Immersion Gold
Board Thickness
0.63mm (Finished)
Transport Package
Kk Paper, 3-Layer Wrinkle
Specification
94mm x 90mm (± 0.15mm)
Production Capacity
360000 Square Meters/Year
Product Overview
Rogers TMM4 High-Frequency PCB is a 2-Layer 0.63mm laminate engineered for high-performance RF & Microwave applications. This thermoset microwave material is a composite of ceramic, hydrocarbon, and thermoset polymer, optimized for strip-line and micro-strip configurations.
The TMM4 material merges the mechanical robustness of ceramics with the electrical advantages of PTFE laminates, ensuring exceptional plated-through-hole (PTH) reliability. Its thermoset resin base prevents pad lifting and substrate warping during wire-bonding operations, offering superior dimensional stability and chemical resistance.
PCB Construction Details
| Parameter |
Specification |
| Base Material | Rogers TMM4 Thermoset Composite |
| Layer Count | 2-Layer Rigid |
| Board Dimensions | 94mm x 90mm (±0.15mm) |
| Minimum Trace/Space | 5/5 mils |
| Minimum Hole Size | 0.4mm |
| Finished Thickness | 0.63mm |
| Copper Weight (Outer Layers) | 1oz (35μm) |
| Surface Finish | Immersion Gold |
| Solder Mask (Top/Bottom) | Green / None |
| Via Plating Thickness | 20μm |
| Electrical Testing | 100% Tested Pre-Shipment |
Stackup Architecture:
• Copper Layer 1: 35 μm
• Substrate (Rogers TMM4): 0.508 mm (20mil)
• Copper Layer 2: 35 μm
Material Advantages & Technical Specs
- Stable Dk: Dielectric constant of 4.50 ±0.045 at 10GHz.
- Ultra-Low Loss: Dissipation factor of 0.0020 for minimal signal attenuation.
- Thermal Reliability: CTE matched to copper (16ppm/°K x/y, 21ppm/°K z).
- Thermal Resilience: Decomposition temperature of 425°C.
- Wire-Bonding Friendly: Thermoset resin prevents pad lifting.
Typical Applications
- RF and microwave circuitry
- Power amplifiers and combiners
- Satellite communication systems
- Filters and couplers
- GPS Antennas and Patch Antennas
- Dielectric polarizers and lenses
Frequently Asked Questions
What is the primary benefit of Rogers TMM4 material?
Rogers TMM4 combines the electrical properties of PTFE with the mechanical stability of ceramic, offering excellent thermal expansion matching with copper and high resistance to warping.
Does this PCB support wire-bonding?
Yes. The thermoset resin system used in TMM4 is specifically designed to be wire-bonding friendly, preventing pad lifting during the process.
What are the dielectric properties of TMM4 at high frequencies?
It features a stable Dielectric Constant (Dk) of 4.50 ±0.045 and an ultra-low Dissipation Factor (Df) of 0.0020 at 10GHz.
Is TMM4 resistant to moisture?
Yes, TMM4 has very low moisture absorption (typically between 0.07% and 0.18%), making it suitable for aerospace and outdoor communication equipment.
What surface finish is applied to this BIC-1057-V2.1 model?
This model features an Immersion Gold surface finish, which provides excellent oxidation resistance and a flat surface for SMT components.
What manufacturing standards does this PCB follow?
The board is manufactured to meet IPC-Class-2 standards, ensuring reliable performance for industrial and commercial RF applications.
Tags: Rogers TMM4 PCB, 2-Layer PCB, 0.63mm PCB Thickness, High-Frequency PCB, RF/Microwave Circuit Board, Thermoset Microwave Material, Immersion Gold Surface Finish, 5/5 mil Trace/Space, Plated Through-Hole Reliability, IPC-Class-2 Standard, Satellite Communication PCB, GPS Antenna Circuit Board, Power Amplifier PCB, RF Filters and Couplers, Aerospace PCB Solutions
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